2026年功能材料与柔性电子器件国际学术会议(FMFED 2026)
2026 International Conference on Functional Materials and Flexible Electronic Devices
Submission Deadline
2026.7.13
Registration Deadline
2026.7.20
Conference Date
2026.8.2
Notification Date: About a week after the submission
城市: 中国,开封
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Scopes
Topic 1: Functional Materials
New material
Optoelectronic functional materials and devices
Adhesive material
Amorphous/Crystalline Materials
Building materials
Catalytic ceramic materials
Coating material
Colloids and Materials Science
Composite Materials Science and Applications
Computer aided material design
Conductive materials
Absorbent material
Topic 2: Flexible Electronic Devices and Manufacturing
Flexible and stretchable substrates
Flexible thin film transistor and logic circuit
Flexible Display and Electronic Paper
Flexible energy storage devices
Flexible Circuit Design and Bending Reliability
Wearable physical/chemical/biological sensors
Electronic skin and tactile sensing
Strain/pressure/temperature sensors
Gas and humidity sensing
Multimodal sensing fusion and sensing array
Roll to roll printing electronics
Inkjet printing and transfer printing technology
Flexible packaging technology
Biological MEMS processing
Manufacturing of large-area flexible devices
Bio integrated electronics and implantable devices
Brain computer interface and neural interface
Wearable health monitoring devices
Intelligent drug delivery system
New material
Optoelectronic functional materials and devices
Adhesive material
Amorphous/Crystalline Materials
Building materials
Catalytic ceramic materials
Coating material
Colloids and Materials Science
Composite Materials Science and Applications
Computer aided material design
Conductive materials
Absorbent material
Topic 2: Flexible Electronic Devices and Manufacturing
Flexible and stretchable substrates
Flexible thin film transistor and logic circuit
Flexible Display and Electronic Paper
Flexible energy storage devices
Flexible Circuit Design and Bending Reliability
Wearable physical/chemical/biological sensors
Electronic skin and tactile sensing
Strain/pressure/temperature sensors
Gas and humidity sensing
Multimodal sensing fusion and sensing array
Roll to roll printing electronics
Inkjet printing and transfer printing technology
Flexible packaging technology
Biological MEMS processing
Manufacturing of large-area flexible devices
Bio integrated electronics and implantable devices
Brain computer interface and neural interface
Wearable health monitoring devices
Intelligent drug delivery system
Important Dates/重要日期
- Submission Deadline: 2026.7.13
- Registration Deadline: 2026.7.20
- Conference Date: 2026.8.2
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: int_tech@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
田老师
+86-17162865530(微信同号)
3766818743
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