2026年功能材料与柔性电子器件国际学术会议(FMFED 2026)
2026 International Conference on Functional Materials and Flexible Electronic Devices
Submission Deadline
2026.7.13
Registration Deadline
2026.7.20
Conference Date
2026.8.2
Notification Date: About a week after the submission
城市: 中国，开封
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contact/联系我们
Submission Portal/投稿方式
Mail Address: int_tech@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
田老师
+86-17162865530（微信同号）
3766818743
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Important Dates/重要日期
- Submission Deadline: 2026.7.13
- Registration Deadline: 2026.7.20
- Conference Date: 2026.8.2
- Notification Date: About a week after the submission