2026年功能材料与柔性电子器件国际学术会议(FMFED 2026)
2026 International Conference on Functional Materials and Flexible Electronic Devices
Submission Deadline
2026.7.13
Registration Deadline
2026.7.20
Conference Date
2026.8.2
Notification Date: About a week after the submission
城市: 中国，开封
距会议开始还有
天
时
分
秒
Wasawat Nakkiew, Mae Fah Luang University, Thailand
Mario Ferreira, University of Aveiro, Portugal
Zuruzi Abu Samah, Alfaisal University, Kingdom of Saudi Arabia
Arun Balodi, Atria Institute of Technology, India
Hafizur Rahaman, Microelectronics and VLSI Design, India
Daolun Chen, Toronto Metropolitan University, Canada
Jonas Örtegren, Mid Sweden University, Sweden
Murat Tolga OZKAN, Gazi University, Turkey
Emad M. Ahmed, Aswan University, Saudi Arabia
- Submission Deadline: 2026.7.13
- Registration Deadline: 2026.7.20
- Conference Date: 2026.8.2
- Notification Date: About a week after the submission
Mail Address: int_tech@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
+86-17162865530（微信同号）
3766818743
- +86---（微信同号）
- --