Welcome to LTTNMPT 2026

2026 International Conference on Low Temperature Technology, New Materials and Processing Technology

2026低温技术、新材料与加工技术国际会议(LTTNMPT 2026)

2026 International Conference on Low Temperature Technology, New Materials and Processing Technology

Submission Deadline

2026.6.28

Registration Deadline

2026.7.06

Conference Date

2026.7.13

Notification Date: About a week after the submission

城市: 沈阳

距会议开始还有

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欢迎投稿~
Scopes
(The following topics include but are not limited to)
Topic 1: Low temperature technology
Refrigeration Engineering Direction
Low temperature engineering direction
Heat pump technology direction
New refrigerants and environmental protection technology direction
Simulation and Control Direction of Refrigeration and Heat Pump Systems
Low temperature biomedical technology direction
Testing and optimization direction of refrigeration equipment
Special refrigeration machinery and air conditioning direction
Low temperature refrigeration and food freezing and refrigeration direction
Topic 2: New Materials
Magnetic Resistive Conductors and Their Storage Applications
Material Innovation in Intelligent Power Systems
New semiconductor materials and devices
Application of Graphene and Two Dimensional Materials in Electronic Devices
Innovation and Development of Photovoltaic Materials
Nanoelectronics and Nanomaterials
Application of Nanomaterials in Electromagnetic Interference Shielding
Environmentally friendly electronic materials
Material Innovation in Intelligent Sensors
New Developments in Flexible Electronic Materials
Research and development of high-performance magnetic materials
Application of Degradable Materials in Electronic Devices
Innovation in Materials for High Power Electronic Devices
Material Technology of MEMS Sensors
The Challenge of High Performance MEMS Materials
Advanced thermal interface materials for electronic devices
Thermal Management of Electronic Materials
Advanced electrical equipment and application of new materials
Material Processing and Optimization
magnetic material
composite material
Stretchable electronic materials
Topic 3: Processing Technology
metal material
metal processing
material characterization
Metal based composite materials
Metal surface engineering
Nanostructured materials
Modeling and simulation of materials
Important Dates/重要日期
  • Submission Deadline: 2026.6.28
  • Registration Deadline: 2026.7.06
  • Conference Date: 2026.7.13
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  icmdsis_info@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

叶老师
  • +86-17162862552(微信同号)
  • 3928825776
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