2026 International Conference on Low Temperature Technology, New Materials and Processing Technology

2026低温技术、新材料与加工技术国际会议(LTTNMPT 2026)

Submission Deadline

2026.6.28

Registration Deadline

2026.7.06

Conference Date

2026.7.13

Notification Date: About a week after the submission

城市: 沈阳

距会议开始还有

天

时

分

秒

欢迎投稿~

ORGANIZING COMMITTEES/组委会

Conference Committee

Assoc. Prof.Mohd Fadzli Bin Abdollah, Universiti Teknikal Malaysia Melaka, Malaysia

Assoc. Prof. Claudio Gallicchio, University of Pisa, Italy

Assoc. Prof. Sahil Verma, Lovely Professional University, India

Program Committee

Dr. Reza Abdi Behnagh, Urmia University of Technology, Iran

A. Prof. Ching Yern Chee, University of Malaya, Malaysia

A.Prof. Ajay Kumar Agarwal, JB Knowledge Park, India

International Technical Committee

A. Prof. Erjia Liu, National University of Singapore, Singapore

A. Prof. Ching Yern Chee, University of Malaya, Malaysia

Dr. Yumn Suhaylah Yusoff, Universiti Sains Islam Malaysia, Malaysia

Important Dates/重要日期

Submission Portal/投稿方式

Mail Address: icmdsis_info@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

叶老师