Welcome to ICSMD 2026

2026 International Conference on Semiconductor Materials, Electronic Devices and Integrated Systems

Scopes
(The following topics include but are not limited to)
Track 1: Semiconductor Materials Materials Science
Semiconductor Spin Physics and Topological Phenomena
Semiconductor Nanoscale and Devices
Wide/Narrow Bandgap Semiconductors
Compound Semiconductors, Magnetic Semiconductors, Organic Semiconductors
Optoelectronic and Photovoltaic Devices
Semiconductor Physics
Semiconductor Quantum Computing
Semiconductor Materials and Device Reliability
Semiconductor Manufacturing and Applications
Emerging Semiconductor Technologies
3D Semiconductor Device Technology Sensor
Full Integration Automation
Automatic Detection
Track 2: Electronic Devices
Nanoelectronic Devices
Organic Electronic Technology
Power Device Design
Integrated Circuit Design
Development of Sensor Technology
Flexible Electronic Devices
Microelectronic Manufacturing Processes
Quantum Electronic Devices
Research on Optoelectronic Devices
High-Frequency Electronic Devices
New Storage Devices
Low-Power Electronic Design
Thermal Management Technology
Device Reliability Analysis
Track 3: Integrated Systems
Three-Dimensional Integrated Circuits and Their Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technology
Development and Innovation of Package-Level Integration Technology
Thermal Management Technology in Integrated Circuits
RF Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Safety Challenges in Integrated Circuit Design
Silicon Photonics Interconnection Technology
Latest Advances in Ultra-Large Scale Integration Technology
Emerging Memory Integration Technology
Integrated Application of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensing Systems ......
Important Dates | 重要日期
  • Submission Deadline: 2026.2.9
  • Registration Deadline: 2026.2.16
  • Conference Date: 2026.2.24
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  icassp_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

蒋老师
  • +86-15680824672(微信同号)
  • 3761629232
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Indexing Service | 索引服务