Scopes
(Topics include but are not limited to)
New semiconductor materials (wide bandgap, two-dimensional materials, etc.)
Semiconductor thin film growth and epitaxial technology
Advanced photolithography and etching processes
Integrated Circuit Design and EDA Tools
Low power consumption and high-performance chip architecture
3D Integration and Advanced Packaging Technology
Power Semiconductor Devices and Modules
RF and millimeter wave integrated circuits
Analog and mixed signal integrated circuits
Memory Technology and New Storage Devices
Integrated Manufacturing of Sensors and MEMS
Reliability Testing and Failure Analysis of Semiconductor Devices
Semiconductor manufacturing process control and yield improvement
Design and Calibration of Precision Instruments and Meters
Intelligent sensors and measurement systems
Optoelectronic integration and silicon-based photonic chips
Flexible Electronics and Wearable Devices
Quantum Devices and Low Temperature Electronics
Semiconductor Material Calculation and Simulation
Integrated Circuit Testing and Verification Methods
Signal processing technology in instruments and meters
Key component technology for semiconductor equipment
Chip security and hardware trustworthiness
Standardization and Localization of Semiconductor Industry
The Application of Integrated Circuits in Artificial Intelligence and the Internet of Things
New semiconductor materials (wide bandgap, two-dimensional materials, etc.)
Semiconductor thin film growth and epitaxial technology
Advanced photolithography and etching processes
Integrated Circuit Design and EDA Tools
Low power consumption and high-performance chip architecture
3D Integration and Advanced Packaging Technology
Power Semiconductor Devices and Modules
RF and millimeter wave integrated circuits
Analog and mixed signal integrated circuits
Memory Technology and New Storage Devices
Integrated Manufacturing of Sensors and MEMS
Reliability Testing and Failure Analysis of Semiconductor Devices
Semiconductor manufacturing process control and yield improvement
Design and Calibration of Precision Instruments and Meters
Intelligent sensors and measurement systems
Optoelectronic integration and silicon-based photonic chips
Flexible Electronics and Wearable Devices
Quantum Devices and Low Temperature Electronics
Semiconductor Material Calculation and Simulation
Integrated Circuit Testing and Verification Methods
Signal processing technology in instruments and meters
Key component technology for semiconductor equipment
Chip security and hardware trustworthiness
Standardization and Localization of Semiconductor Industry
The Application of Integrated Circuits in Artificial Intelligence and the Internet of Things
Important Dates/重要日期
- Submission Deadline: 2026.10.25
- Registration Deadline: 2026.10.30
- Conference Date: 2026.11.14
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: yhzdb_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
张老师
+86-17162863232(微信同号)
3771563441
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+86---(微信同号)
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