(Topics include but are not limited to)
New semiconductor materials (wide bandgap, two-dimensional materials, perovskite)
Semiconductor epitaxial growth and thin film deposition technologies
Extreme ultraviolet (EUV) lithography and advanced patterning processes
Atomic layer deposition (ALD) and atomic layer etching (ALE)
Integration of advanced process nodes (3nm and below) technologies
Three-dimensional integration and advanced packaging technologies
New storage materials and device manufacturing
Power semiconductor materials and device processes
Compound semiconductor (GaN, SiC) manufacturing technologies
Defect control and yield improvement in semiconductor manufacturing
Online monitoring and measurement in chip manufacturing process
Integrated design and process optimization (DTCO) of integrated circuits
Advanced interconnect materials and low dielectric constant media
Wafer-level packaging and corelet (Chiplet) integration
Key component technologies of semiconductor manufacturing equipment
Cleanroom technology and pollution control
Semiconductor material computing and process simulation
New photomasks and auxiliary materials
AI and big data applications in integrated circuit manufacturing
Semiconductor process standardization and domestication path
Flexible electronics and heterogeneous integration manufacturing
Quantum devices and low-temperature electronic manufacturing processes
Green processes and sustainable development in semiconductor manufacturing
Integrated circuit manufacturing talent cultivation and industry-university-research cooperation