Scopes
Topic 1: Semiconductors
Semiconductor spin physics and topological phenomena
Semiconductor Nanotechnology and Devices
Wide/narrow bandgap semiconductor
Compound semiconductor
Magnetic semiconductor
Organic semiconductor
Optoelectronics and photovoltaic devices
Semiconductor physics
Semiconductor quantum computing
Physics of Microwave Photon Devices
Reliability of Semiconductor Materials and Devices
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
Advanced photoresist
Topic 2: Electromagnetic Compatibility and Electromagnetic Interference
EMC and EMI modeling
EMC testing methods in industry and environment
Near field for solving FF problems
Near field detector and functional safety NF scan for PCB characterization
Topic Three: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Semiconductor spin physics and topological phenomena
Semiconductor Nanotechnology and Devices
Wide/narrow bandgap semiconductor
Compound semiconductor
Magnetic semiconductor
Organic semiconductor
Optoelectronics and photovoltaic devices
Semiconductor physics
Semiconductor quantum computing
Physics of Microwave Photon Devices
Reliability of Semiconductor Materials and Devices
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
Advanced photoresist
Topic 2: Electromagnetic Compatibility and Electromagnetic Interference
EMC and EMI modeling
EMC testing methods in industry and environment
Near field for solving FF problems
Near field detector and functional safety NF scan for PCB characterization
Topic Three: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Important Dates/重要日期
- Submission Deadline: 2026.7.10
- Registration Deadline: 2026.7.17
- Conference Date: 2026.7.30
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: ei_iacapa@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
唐老师
+86-17168296597(微信同号)
3264234551
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+86---(微信同号)
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