Welcome to SDAMIT 2026

2026 International Conference on Semiconductor Devices, Advanced Manufacturing and Integration Techn

Scopes
Topic 1: Semiconductor Devices
New semiconductor materials and their applications in devices
Design and Optimization of High Performance MOSFET
Power device technology for optimizing energy efficiency
III-V compound semiconductor devices surpassing silicon
Micro Electro Semiconductor Sensors and Their Applications
Semiconductor lasers and their emerging application fields
Graphene and other two-dimensional material devices
Quantum dot and quantum well semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and Opportunities of Low Temperature Electronic Devices
Breakthrough Technologies for High Frequency and High Power Devices
Silicon based optoelectronic devices and their integration technology
Research on Tunneling Field Effect Transistor (TFET) Devices
Reliability and Aging Mechanism of Semiconductor Devices
The impact of advanced packaging and interconnect structures on device performance
Topic 2: Advanced Manufacturing Technology
Material Calculation and Numerical Simulation
Material Processing and Forming Technology
Laser processing technology
Intelligent Manufacturing Technology
Additive Manufacturing Technology
Microelectronics Packaging Testing and Manufacturing Technology
Smart construction technology
Precision and ultra precision machining technology
Topic 3: Integrated Technology
Three dimensional integrated circuits and their manufacturing processes
System on Chip (SoC) and Integration Methods
Heterogeneous chip integration technology
Development and Innovation of Package Level Integration Technology
Thermal management technology in integrated circuits
RF Integrated Circuit and Its Design Optimization
The Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed Signal Integrated Circuit
Power Management Integrated Circuit Technology
Reliability and Safety Challenges in Integrated Circuit Design
Silicon photonics interconnect technology
The latest progress in ultra large scale integration technology
Emerging Memory Integration Technologies
Integrated Application of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensor Systems
Important Dates | 重要日期
  • Submission Deadline: 2026.7.19
  • Registration Deadline: 2026.7.26
  • Conference Date: 2026.8.8
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  conf_focloi@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

唐老师
  • +86-17162865530(微信同号)
  • 3766818743
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Indexing Service | 索引服务