Scopes
(The following topics include but are not limited to)
Topic 1: Quantum Chips
Superconducting quantum bit chip
Semiconductor quantum dot chip
Topological Quantum Chip Design
Photon integrated quantum chip
Ion trap and neutral atom chip
Quantum chip packaging and interconnection
Chip level quantum control circuit
Quantum chip testing and characterization
Topic 2: Quantum Devices
Preparation and manipulation of quantum bits
Quantum Memory and Repeaters
Single photon source and detector
Quantum sensing devices
Microwave and Optical Interface Devices
Low temperature electronic devices
Quantum error correction hardware
Device noise and decoherence suppression
Topic 3: Integrated Technology
Quantum classical hybrid integration
Multi bit expansion and scaling
Chip manufacturing process (CMOS compatible, etc.)
3D integration and heterogeneous integration
Integrated Quantum Optical Path
System level packaging and modularization
Integrated Reliability Engineering
Quantum Integrated System Testing Platform
Important Dates/重要日期
  • Submission Deadline: 2026.03.05
  • Registration Deadline: 2026.03.10
  • Conference Date: 2026.03.22
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  eieditor@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

墨老师
  • +86-15680957221(微信同号)
  • 2580953988
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