Topic 1: Micro Nano Processing
Lithography and Exposure Technology
Etching process and selection ratio
Thin film deposition and growth
Chemical mechanical planarization
Self assembling nano processing
Electron beam and ion beam processing
Soft lithography and nanoimprinting
3D micro nano structure manufacturing
Micro nano scale detection technology
Cleaning and stain removal process
Process Integration and Process Design
Micro nano processing new materials
Process modeling and simulation
Defect control and yield improvement
Equipment development and localization
Low damage processing technology
Standardization of Micro Nano Processing
Emerging Processing Technologies
Pre packaging and integration process
Cost Control and Environmental Protection
Topic 2: Semiconductor Devices
New transistor structure
Memory device technology
Power semiconductor devices
RF and Microwave Devices
Sensors and MEMS
Optoelectronics and detection devices
Quantum Devices and Computing
Neuromorphic devices
Flexible and stretchable devices
Device Physics and Modeling
Reliability and Failure Analysis
Exploration of Device Performance Limits
Heterogeneous integrated device
Low power device design
High temperature and irradiation devices
Biomedical devices
Device simulation and optimization
Application of new materials
Device testing and characterization
Future Device Architecture
Topic 3: Integrated Systems
System level packaging technology
Heterogeneous Integration
Chip design and interconnection
3D integration technology
Silicon-based optoelectronic integration
RF front-end integration
Microsystems and SoC
Integrated system thermal management
Signal integrity design
Power management integration
Testing and Design for Testability
Integrated system reliability
Packaging materials and processes
System level simulation verification
Integrated system application scenarios
Artificial intelligence chip integration
Automotive Electronic Integration
IoT node integration
Integrated System Security
Standards and Design Ecology
Other related topics