Welcome to MEMSSDIT 2026

2026 International Conference on Micro-Electro-Mechanical Systems, Sensing Devices and Integration T

Scopes
(The following topics include but are not limited to)
Topic 1: Micro Electro Mechanical Systems
MEMS Design and Simulation
MEMS manufacturing process
MEMS Packaging Technology
Inertial MEMS devices
Optical MEMS devices
RF MEMS devices
Application of Biological MEMS
MEMS reliability
Topic 2: Sensor Devices
Physical quantity sensor
Chemical and Biological Sensors
Gas Sensor Technology
Pressure and flow sensors
Temperature and humidity sensor
Inertial sensor
Smart Sensor
Sensor signal conditioning
Topic 3: Integrated Technology
Sensor and Circuit Integration
Integration of MEMS and CMOS
Heterogeneous Integration Technology
3D integrated packaging
system-level packaging
Integrated microsystem
Integration process compatibility
Integration testing and validation
Important Dates | 重要日期
  • Submission Deadline: 2026.5.6
  • Registration Deadline: 2026.5.16
  • Conference Date: 2026.5.21
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  eiic_Conference@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

墨老师
  • +86-15680957221(微信同号)
  • 2580953988
--
  • +86---(微信同号)
  • --
Indexing Service | 索引服务