Scopes
(The following topics include but are not limited to)
Track 1: Semiconductor Physics and Materials
Wide bandgap semiconductors (GaN, SiC, Ga₂O₃, etc.)
Low-dimensional semiconductor physics
Quantum semiconductor physics
Compound semiconductors
Organic semiconductors and flexible/wearable semiconductors
Magnetic semiconductors and semiconductor spintronics
Carrier dynamics and transport mechanisms
Impurities and defects in semiconductors
Semiconductor physics under high magnetic fields/high pressure
Semiconductor material growth and processing
Semiconductor device modeling and simulation
Progress in semiconductor manufacturing and lithography technology
Emerging semiconductor technologies
Semiconductor applications in artificial intelligence
Track 2: Optoelectronic Devices and Photonic Systems
Light Emitting Diodes (LEDs) and Semiconductor Lasers
Photoelectric Detectors and Photoelectric Sensors
Solar Cells and Advanced Photovoltaic Technologies
Photoelectric Displays and New Display Technologies
Optical Modulators, Optical Switches and Optical Logic Devices
Photoelectric Imaging and Visual Perception
Single Photon Emitters and Detectors
Perovskite and Quantum Dot Optoelectronic Devices
Nanophotonics and Ultrafast Optoelectronics
Optoelectronic Device Physics and Simulation
Optoelectronic Materials and Components
Optical Fiber Technology and Applications
Optical Measurement, Ranging and Laser Radar
Optical Communication and Optical Networks
Optoelectronic Chips and Optoelectronic Integration
Optical Conversion Materials and Technologies
Track 3: Integration Technology and Advanced Packaging
Three-dimensional Integrated Circuits and Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technology
Packaging-level Integration Technology and Innovation
Thermal Management Technology in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Safety Challenges in Integrated Circuit Design
Silicon Photonics and Optical Interconnection Technology
Co-packaged Optics (CPO) and Optoelectronic Integration
Progress in Ultra Large Scale Integration Technology
Emerging Memory Integration Technologies
Modular MEMS and NEMS Integration Applications
Integration and Innovation of Intelligent Sensing Systems...
Track 1: Semiconductor Physics and Materials
Wide bandgap semiconductors (GaN, SiC, Ga₂O₃, etc.)
Low-dimensional semiconductor physics
Quantum semiconductor physics
Compound semiconductors
Organic semiconductors and flexible/wearable semiconductors
Magnetic semiconductors and semiconductor spintronics
Carrier dynamics and transport mechanisms
Impurities and defects in semiconductors
Semiconductor physics under high magnetic fields/high pressure
Semiconductor material growth and processing
Semiconductor device modeling and simulation
Progress in semiconductor manufacturing and lithography technology
Emerging semiconductor technologies
Semiconductor applications in artificial intelligence
Track 2: Optoelectronic Devices and Photonic Systems
Light Emitting Diodes (LEDs) and Semiconductor Lasers
Photoelectric Detectors and Photoelectric Sensors
Solar Cells and Advanced Photovoltaic Technologies
Photoelectric Displays and New Display Technologies
Optical Modulators, Optical Switches and Optical Logic Devices
Photoelectric Imaging and Visual Perception
Single Photon Emitters and Detectors
Perovskite and Quantum Dot Optoelectronic Devices
Nanophotonics and Ultrafast Optoelectronics
Optoelectronic Device Physics and Simulation
Optoelectronic Materials and Components
Optical Fiber Technology and Applications
Optical Measurement, Ranging and Laser Radar
Optical Communication and Optical Networks
Optoelectronic Chips and Optoelectronic Integration
Optical Conversion Materials and Technologies
Track 3: Integration Technology and Advanced Packaging
Three-dimensional Integrated Circuits and Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technology
Packaging-level Integration Technology and Innovation
Thermal Management Technology in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Safety Challenges in Integrated Circuit Design
Silicon Photonics and Optical Interconnection Technology
Co-packaged Optics (CPO) and Optoelectronic Integration
Progress in Ultra Large Scale Integration Technology
Emerging Memory Integration Technologies
Modular MEMS and NEMS Integration Applications
Integration and Innovation of Intelligent Sensing Systems...
Important Dates/重要日期
- Submission Deadline: 2026.11.3
- Registration Deadline: 2026.11.10
- Conference Date: 2026.11.18
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: iacademic_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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