Scopes
(Including but not limited to the following topics)
Track 1: Semiconductor Physics
Wide bandgap semiconductors
Low-dimensional semiconductor physics, quantum semiconductor physics
Optoelectronics semiconductors
Carrier dynamics and transport mechanisms
Next-generation transistors
Flexible and wearable semiconductors
Semiconductors for 5G and beyond technologies
Advanced photovoltaic technologies
Semiconductor sensors
Compound semiconductors
Semiconductors in artificial intelligence
Progress in semiconductor manufacturing and lithography technology
High magnetic field/high voltage in semiconductor physics
Impurities/defects in semiconductors
Light-emitting diodes (LEDs) and diode lasers
New semiconductor devices and applications
Organic semiconductors
Semiconductor materials and applications
Semiconductor spintronics
Semiconductor detectors
Track 2: Integrated Circuit Design
Integrated circuit computer-aided design technology, manufacturability design
Signal denoising and processing
Highly integrated front-end circuits and devices
Communication integrated circuits
Physical design of integrated circuits and systems
Wireless system devices and circuits
Devices, hardware and methods inspired by biology and neuromorphic computing
Manufacturing, processing, packaging and testing technologies of integrated circuits and devices
Electronic design automation
Data paths in digital processors
Embedded/multi-processor systems
Hardware-software co-design and co-verification
Track 3: Manufacturing Technology
Intelligent manufacturing and automation
Precision and ultra-precision processing technologies
Micro-nano manufacturing technologies
Additive manufacturing and new material technologies
Digital design and manufacturing
Manufacturing systems and control
Mechanical design and dynamics
Advanced manufacturing equipment and technologies
Track 1: Semiconductor Physics
Wide bandgap semiconductors
Low-dimensional semiconductor physics, quantum semiconductor physics
Optoelectronics semiconductors
Carrier dynamics and transport mechanisms
Next-generation transistors
Flexible and wearable semiconductors
Semiconductors for 5G and beyond technologies
Advanced photovoltaic technologies
Semiconductor sensors
Compound semiconductors
Semiconductors in artificial intelligence
Progress in semiconductor manufacturing and lithography technology
High magnetic field/high voltage in semiconductor physics
Impurities/defects in semiconductors
Light-emitting diodes (LEDs) and diode lasers
New semiconductor devices and applications
Organic semiconductors
Semiconductor materials and applications
Semiconductor spintronics
Semiconductor detectors
Track 2: Integrated Circuit Design
Integrated circuit computer-aided design technology, manufacturability design
Signal denoising and processing
Highly integrated front-end circuits and devices
Communication integrated circuits
Physical design of integrated circuits and systems
Wireless system devices and circuits
Devices, hardware and methods inspired by biology and neuromorphic computing
Manufacturing, processing, packaging and testing technologies of integrated circuits and devices
Electronic design automation
Data paths in digital processors
Embedded/multi-processor systems
Hardware-software co-design and co-verification
Track 3: Manufacturing Technology
Intelligent manufacturing and automation
Precision and ultra-precision processing technologies
Micro-nano manufacturing technologies
Additive manufacturing and new material technologies
Digital design and manufacturing
Manufacturing systems and control
Mechanical design and dynamics
Advanced manufacturing equipment and technologies
Important Dates/重要日期
- Submission Deadline: 2026.6.22
- Registration Deadline: 2026.6.29
- Conference Date: 2026.7.7
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: iclmsed_id@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
+86-15680829715(微信同号)
1347638002
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+86---(微信同号)
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