(Including but not limited to the following topics)
Track 1: Semiconductor Materials
Development of new semiconductor materials
Application of nanomaterials and two-dimensional materials
Characterization techniques of semiconductor materials
Crystal growth and material preparation
Material defects and interface engineering
Functional materials and composite materials
Advanced deposition and etching processes
Wafer processing and manufacturing technologies
Material reliability and failure analysis
Application of material innovation in semiconductor devices
Track 2: Optoelectronic Devices
Optoelectronic materials
Optoelectronic detection and intelligent sensing
Optoelectronic display
Optoelectronic information and processing
Optoelectronic materials and components
Optical measurement, ranging and vision
Optical sensors and applications
Optical fiber technology and applications
Optical chips
Optical imaging and precision detection
Optical communication and networks
Laser technology and applications
Electronic circuits and technologies
Track 3: Integration Technology
Three-dimensional integrated circuits and their manufacturing processes
System-on-Chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of packaging-level integration technology
Thermal management technology in integrated circuits
RF integrated circuits and design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed-signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnection technology
Latest progress in ultra-large-scale integration technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems ......