Scopes
(The following topics include but are not limited to)
Track 1: Semiconductor Devices and Chip Technology
Advanced Logic and Storage Technologies
Emerging Storage Devices
Wide Bandgap/Ultra-Wide Bandgap Semiconductor Materials and Devices
RF/Millimeter Wave/Terahertz Semiconductor Devices
Quantum Devices, Spintronic Devices and Low-Temperature Electronics
Memory-Computing-Processing Integrated Chips, Brain Computing Chips and Neuromorphic Devices
Silicon Photonics Integration and Photonic Devices
Two-Dimensional Materials and New Logic Devices
Device Physics Modeling and TCAD Simulation
Device Reliability Physics and Degradation Mechanisms
Semiconductor Manufacturing Processes
Semiconductor Material Characterization and Testing Technologies
Track 2: Power Electronics and Integration Technology
Power Semiconductor Device Design and Reliability
Power Integrated Circuits and Intelligent Power Modules
Gate Drive ICs and High Voltage Isolation Technologies
Thermal Management, Packaging and Low Inductance Interconnects for Power Devices
Power System-on-Chip and Monolithic Integration
EMI/EMC Modeling and Suppression for Power Electronic Systems
Task Profile Life Prediction and Online Monitoring for Power Devices
Threshold Stability and Short-Circuit Robustness of Wide Bandgap Power Devices
Chip-Package Interactions and Reliability of Power Modules
RF Power Amplifiers and Microwave Power Devices
Power Management Integrated Circuits and Energy Efficiency Enhancement Technologies
Track 3: Micro/Nano Technology and Intelligent Systems
MEMS/NEMS Design and Manufacturing Processes
Micro/Nano Sensors and Actuators
Micro/Nano Optoelectronic Devices and Nanophotonics
Micro/Nano Fluidic Devices and Biomedical Microsystems
Flexible Electronic Devices and Wearable Sensors
Micro/Nano Energy Harvesting Devices and Self-Powered Systems
Micro/Nano Robotics Technology
RF MEMS and Piezoelectric/Acoustic MEMS Devices
3D Printing and Bioprinting Technologies
Micro/Nano System Packaging and Heterogeneous Hetero-Integration
AI-Driven Micro/Nano System Design, Simulation and Optimization
Micro/Nano Composite Functional Materials and Structures
...
Track 1: Semiconductor Devices and Chip Technology
Advanced Logic and Storage Technologies
Emerging Storage Devices
Wide Bandgap/Ultra-Wide Bandgap Semiconductor Materials and Devices
RF/Millimeter Wave/Terahertz Semiconductor Devices
Quantum Devices, Spintronic Devices and Low-Temperature Electronics
Memory-Computing-Processing Integrated Chips, Brain Computing Chips and Neuromorphic Devices
Silicon Photonics Integration and Photonic Devices
Two-Dimensional Materials and New Logic Devices
Device Physics Modeling and TCAD Simulation
Device Reliability Physics and Degradation Mechanisms
Semiconductor Manufacturing Processes
Semiconductor Material Characterization and Testing Technologies
Track 2: Power Electronics and Integration Technology
Power Semiconductor Device Design and Reliability
Power Integrated Circuits and Intelligent Power Modules
Gate Drive ICs and High Voltage Isolation Technologies
Thermal Management, Packaging and Low Inductance Interconnects for Power Devices
Power System-on-Chip and Monolithic Integration
EMI/EMC Modeling and Suppression for Power Electronic Systems
Task Profile Life Prediction and Online Monitoring for Power Devices
Threshold Stability and Short-Circuit Robustness of Wide Bandgap Power Devices
Chip-Package Interactions and Reliability of Power Modules
RF Power Amplifiers and Microwave Power Devices
Power Management Integrated Circuits and Energy Efficiency Enhancement Technologies
Track 3: Micro/Nano Technology and Intelligent Systems
MEMS/NEMS Design and Manufacturing Processes
Micro/Nano Sensors and Actuators
Micro/Nano Optoelectronic Devices and Nanophotonics
Micro/Nano Fluidic Devices and Biomedical Microsystems
Flexible Electronic Devices and Wearable Sensors
Micro/Nano Energy Harvesting Devices and Self-Powered Systems
Micro/Nano Robotics Technology
RF MEMS and Piezoelectric/Acoustic MEMS Devices
3D Printing and Bioprinting Technologies
Micro/Nano System Packaging and Heterogeneous Hetero-Integration
AI-Driven Micro/Nano System Design, Simulation and Optimization
Micro/Nano Composite Functional Materials and Structures
...
Important Dates/重要日期
- Submission Deadline: 2026.10.7
- Registration Deadline: 2026.10.14
- Conference Date: 2026.10.22
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icmtas_con@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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+86---(微信同号)
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