Scopes
(The following topics include but are not limited to)
Track 1: Optoelectronic Materials
Optical functional materials
Nanoplasmonic thin-film materials
Photonic crystals and microstructured optical fibers
New design and preparation of optoelectronic materials
Organic solar cell materials
Organic electroluminescent diodes and light-emitting chemical batteries
New applications of optoelectronic materials
New optoelectronic functional materials and devices
Preparation and characterization of optoelectronic films
Optical conversion material technologies and applications
Optical information functional materials
Nanophotonics and materials
Optical material chemistry and physics
Organic biochemical sensors
Organic laser-pumped lasers
Organic nonlinear optical materials
Nanophotonics and materials
Photosensitive polymer materials and polymer information storage materials
Organic photoconductive materials
Track 2: Optoelectronic Devices
High-performance photodetector materials and device structure design
Improvement of efficiency and stability of light-emitting devices
New structures and mechanisms of photovoltaic devices
Optical modulators, optical switches and optical logic devices
New structures and wavelength expansion of semiconductor lasers
Optical amplifiers and optical frequency comb devices
Optical sensor devices and on-chip sensing systems
Reliability physics, failure mechanisms and life assessment of optoelectronic devices
Multifield coupling behavior of optoelectronic devices
Track 3: Integration Technologies
Three-dimensional integrated circuits and manufacturing processes
System-on-Chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of packaging-level integration technology
Thermal management technology in integrated circuits
Radio frequency integrated circuits and design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed-signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnection technology
Latest progress in ultra-large-scale integration technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems ......
Track 1: Optoelectronic Materials
Optical functional materials
Nanoplasmonic thin-film materials
Photonic crystals and microstructured optical fibers
New design and preparation of optoelectronic materials
Organic solar cell materials
Organic electroluminescent diodes and light-emitting chemical batteries
New applications of optoelectronic materials
New optoelectronic functional materials and devices
Preparation and characterization of optoelectronic films
Optical conversion material technologies and applications
Optical information functional materials
Nanophotonics and materials
Optical material chemistry and physics
Organic biochemical sensors
Organic laser-pumped lasers
Organic nonlinear optical materials
Nanophotonics and materials
Photosensitive polymer materials and polymer information storage materials
Organic photoconductive materials
Track 2: Optoelectronic Devices
High-performance photodetector materials and device structure design
Improvement of efficiency and stability of light-emitting devices
New structures and mechanisms of photovoltaic devices
Optical modulators, optical switches and optical logic devices
New structures and wavelength expansion of semiconductor lasers
Optical amplifiers and optical frequency comb devices
Optical sensor devices and on-chip sensing systems
Reliability physics, failure mechanisms and life assessment of optoelectronic devices
Multifield coupling behavior of optoelectronic devices
Track 3: Integration Technologies
Three-dimensional integrated circuits and manufacturing processes
System-on-Chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of packaging-level integration technology
Thermal management technology in integrated circuits
Radio frequency integrated circuits and design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed-signal integrated circuits
Power management integrated circuit technology
Reliability and safety challenges in integrated circuit design
Silicon photonics interconnection technology
Latest progress in ultra-large-scale integration technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems ......
Important Dates/重要日期
- Submission Deadline: 2026.8.23
- Registration Deadline: 2026.8.30
- Conference Date: 2026.9.7
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icmla_conference@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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+86---(微信同号)
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