Scopes
(Including but not limited to the following topics)
Track 1: Mechatronics
Robot design and control
Autonomous navigation and intelligent decision-making
Intelligent perception and understanding
Human-computer interaction and collaboration
Bionic robots and soft robots
Multi-robot systems and swarm intelligence
Computer vision and pattern recognition
Natural language processing and voice interaction
Track 2: System Integration
Three-dimensional integrated circuits and manufacturing processes
System-on-Chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of packaging-level integration technology
Thermal management technology in integrated circuits
Radio frequency integrated circuits and design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed-signal integrated circuits
Power management integrated circuit technology
Reliability and security challenges in integrated circuit design
Silicon photonics interconnection technology
Latest progress in ultra-large-scale integration technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems ......
Track 3: Smart Devices
Hardware Design of Smart Terminals
Embedded Artificial Intelligence
Wearable Computing Devices
Smart Device Operating Systems
Power Consumption Management and Optimization of Devices
Interconnection of Smart Devices
Mobile Smart Terminals
Device Security and Trusted Execution ......
Track 1: Mechatronics
Robot design and control
Autonomous navigation and intelligent decision-making
Intelligent perception and understanding
Human-computer interaction and collaboration
Bionic robots and soft robots
Multi-robot systems and swarm intelligence
Computer vision and pattern recognition
Natural language processing and voice interaction
Track 2: System Integration
Three-dimensional integrated circuits and manufacturing processes
System-on-Chip (SoC) and integration methods
Chip heterogeneous integration technology
Development and innovation of packaging-level integration technology
Thermal management technology in integrated circuits
Radio frequency integrated circuits and design optimization
Application of artificial intelligence and machine learning in integrated circuit design
Advanced analog and mixed-signal integrated circuits
Power management integrated circuit technology
Reliability and security challenges in integrated circuit design
Silicon photonics interconnection technology
Latest progress in ultra-large-scale integration technology
Emerging memory integration technology
Integrated application of modular MEMS and NEMS
Integration and innovation of intelligent sensing systems ......
Track 3: Smart Devices
Hardware Design of Smart Terminals
Embedded Artificial Intelligence
Wearable Computing Devices
Smart Device Operating Systems
Power Consumption Management and Optimization of Devices
Interconnection of Smart Devices
Mobile Smart Terminals
Device Security and Trusted Execution ......
Important Dates/重要日期
- Submission Deadline: 2026.4.5
- Registration Deadline: 2026.4.12
- Conference Date: 2026.4.20
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icmbga_conf@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
+86-15680829715(微信同号)
1347638002
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