Scopes
(Including but not limited to the following topics)
Track 1: Materials Physics
Materials Physics and Structure
Materials Thermodynamics
Materials Engineering Fundamentals
Quantum Mechanics
Mechanical Properties of Materials
Microelectronic Materials
Superconductors
Materials Physics and Chemistry
Materials Preparation Techniques
Atomic Physics
Solid State Physics
Optoelectronic Materials Semiconductor
Nanomaterials and Nanotechnology
Track 2: Quantum Computing
Quantum Algorithms and Machine Learning
Quantum Programming
Quantum Optics
Quantum Information Processing
Quantum Tensor Networks
Quantum Error Correction and Mitigation
Fault-Tolerant Quantum Computing
Quantum Control
Hybrid Quantum-Classical Systems
Quantum Computing and Cybersecurity
Track 3: Integration Technologies
Three-Dimensional Integrated Circuits and Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technology
Development and Innovation of Packaging-level Integration Technology
Thermal Management Technology in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Security Challenges in Integrated Circuit Design
Silicon Photonics Interconnection Technology
Latest Advances in Ultra-Large Scale Integration Technology
Emerging Memory Integration Technology
Integrated Applications of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensing Systems ……
Track 1: Materials Physics
Materials Physics and Structure
Materials Thermodynamics
Materials Engineering Fundamentals
Quantum Mechanics
Mechanical Properties of Materials
Microelectronic Materials
Superconductors
Materials Physics and Chemistry
Materials Preparation Techniques
Atomic Physics
Solid State Physics
Optoelectronic Materials Semiconductor
Nanomaterials and Nanotechnology
Track 2: Quantum Computing
Quantum Algorithms and Machine Learning
Quantum Programming
Quantum Optics
Quantum Information Processing
Quantum Tensor Networks
Quantum Error Correction and Mitigation
Fault-Tolerant Quantum Computing
Quantum Control
Hybrid Quantum-Classical Systems
Quantum Computing and Cybersecurity
Track 3: Integration Technologies
Three-Dimensional Integrated Circuits and Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technology
Development and Innovation of Packaging-level Integration Technology
Thermal Management Technology in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Security Challenges in Integrated Circuit Design
Silicon Photonics Interconnection Technology
Latest Advances in Ultra-Large Scale Integration Technology
Emerging Memory Integration Technology
Integrated Applications of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensing Systems ……
Important Dates/重要日期
- Submission Deadline: 2026.7.5
- Registration Deadline: 2026.7.12
- Conference Date: 2026.7.20
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: Copyiaet_irg@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
+86-15680829715(微信同号)
1347638002
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