Scopes
(Including but not limited to the following topics)
Track 1: Microelectronic Science
Quantum computing control circuits, quantum bit readout and classical-quantum interfaces
Silicon photonics and optical computing chips
Flexible electronics, stretchable electronics and bio-compatible electronic systems
Internet of Things (IoT) edge-side chips, low-power wide area networks and edge intelligence
Electronic systems and packaging technologies
Electromagnetic, filters and microwave antennas
Mobile computing and edge computing
Hardware design, embedded systems and systems
Electronics, integrated circuits and systems
Optoelectronic chips
Electronic devices, signals, images and information
Track 2: Integrated Circuits
Advanced process node design methods
Low-power integrated circuit design
High-performance digital and analog circuits
RF and mixed-signal integrated circuits
Three-dimensional integration and heterogeneous integration technologies
Testing, verification and manufacturing process control
Chip packaging and interconnection technologies
Reliability design of integrated circuits
Quantum devices and future integrated circuits
New integrated circuit architectures
Track 3: Semiconductor Engineering
Development of new semiconductor materials
Application of nanomaterials and two-dimensional materials
Characterization techniques of semiconductor materials
Crystal growth and material preparation
Material defects and interface engineering
Functional materials and composite materials
Advanced deposition and etching processes
Wafer processing and manufacturing technologies
Material reliability and failure analysis
Application of material innovation in semiconductor devices
Application of semiconductor devices in artificial intelligence
Internet of Things and intelligent sensing systems
Power electronics and energy management systems
Emerging semiconductor devices and systems
Application of integrated circuits in communication technologies
System-on-Chip (SoC) design and implementation
Manufacturing automation and semiconductor industry automation
Application of semiconductor technology in automotive electronics ......
Track 1: Microelectronic Science
Quantum computing control circuits, quantum bit readout and classical-quantum interfaces
Silicon photonics and optical computing chips
Flexible electronics, stretchable electronics and bio-compatible electronic systems
Internet of Things (IoT) edge-side chips, low-power wide area networks and edge intelligence
Electronic systems and packaging technologies
Electromagnetic, filters and microwave antennas
Mobile computing and edge computing
Hardware design, embedded systems and systems
Electronics, integrated circuits and systems
Optoelectronic chips
Electronic devices, signals, images and information
Track 2: Integrated Circuits
Advanced process node design methods
Low-power integrated circuit design
High-performance digital and analog circuits
RF and mixed-signal integrated circuits
Three-dimensional integration and heterogeneous integration technologies
Testing, verification and manufacturing process control
Chip packaging and interconnection technologies
Reliability design of integrated circuits
Quantum devices and future integrated circuits
New integrated circuit architectures
Track 3: Semiconductor Engineering
Development of new semiconductor materials
Application of nanomaterials and two-dimensional materials
Characterization techniques of semiconductor materials
Crystal growth and material preparation
Material defects and interface engineering
Functional materials and composite materials
Advanced deposition and etching processes
Wafer processing and manufacturing technologies
Material reliability and failure analysis
Application of material innovation in semiconductor devices
Application of semiconductor devices in artificial intelligence
Internet of Things and intelligent sensing systems
Power electronics and energy management systems
Emerging semiconductor devices and systems
Application of integrated circuits in communication technologies
System-on-Chip (SoC) design and implementation
Manufacturing automation and semiconductor industry automation
Application of semiconductor technology in automotive electronics ......
Important Dates/重要日期
- Submission Deadline: 2026.7.26
- Registration Deadline: 2026.8.2
- Conference Date: 2026.8.10
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icomputer_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
+86-15680829715(微信同号)
1347638002
--
+86---(微信同号)
--
