(covering but not limited to the following topics)
Track 1: Microelectronics Technology
Research and application of new semiconductor materials
Design and optimization of silicon-based optoelectronic devices
Application of nanomaterials in microelectronic devices
Development and performance optimization of low-power electronic devices
Application of quantum dots in optoelectronics
Analog circuits and digital circuits
Integrated circuit design and semiconductor devices
Signal processing technology
Embedded systems and Internet of Things
Power electronics and energy management
Microelectronics and nanoelectronics technology
Quantum computing and quantum communication
Quantum electronic devices
Sensor technology and applications
Power electronic converters
Communication electronic technology
Track 2: Automatic Control
Adaptive control
Control systems and applications
Digital control
Fault detection and isolation (FDI)
Industrial automation
Instrumentation and control components Intelligent control
Linear and nonlinear control systems
Optimization and optimal control
Heteronomous systems
Stochastic control and filtering
System identification
Systems and automation
Virtual instruments and control
Track 3: Semiconductor devices
New semiconductor materials and their applications in devices
High-performance MOSFET design and optimization
Power device technology for energy efficiency optimization
III-V group compound semiconductor devices beyond silicon
Microoptoelectronic semiconductor sensors and their applications
Semiconductor lasers and emerging application fields
Graphene and other two-dimensional material devices
Quantum dots and quantum wells semiconductor devices
New memory devices: RRAM, MRAM, FeRAM
Challenges and opportunities of low-temperature electronic devices
Breakthrough technologies for high-frequency and high-power devices
Silicon-based optoelectronic devices and their integration technologies
Research on tunnel field-effect transistors (TFET) devices
Reliability and aging mechanisms of semiconductor devices
Impact of advanced packaging and interconnection structures on device performance