(The following topics include but are not limited to)
Track 1: Laser Technology
(The following topics include but are not limited to)
Laser Physics
New Lasers
Ultrafast Lasers
Track 1: Laser Technology
High-Power Lasers
Laser Physics
Nonlinear Optics
New Lasers
Quantum Optics, Quantum Technology
Ultrafast Lasers
Optical Materials, Metamaterials
High-Power Lasers
Nonlinear Optics
Crystal Optics, Topological Photonics
Photonic Crystals
Terahertz Technology
Quantum Optics, Quantum Technology
Attosecond Science
Laser Processing
Laser Micro-nano Processing
Optical Materials, Metamaterials
Laser Additive Manufacturing
Track 2: Applied Physics
Crystal Optics, Topological Photonics
Photonic Crystals
Condensed Matter Physics and New Materials
Terahertz Technology
Physics and Applied Physics Nuclear physics
Attosecond Science
Laser Processing
Acoustics/Electrics/Optics/Thermics
Laser Micro-nano Processing
Atomic Physics, Solid State Physics
Structure and Properties
Electrical and Electronic Technology
Laser Additive Manufacturing
Semiconductor Physics
Track 2: Applied Physics
Optoelectronics, Optoelectronic Technology and Its Applications
Condensed Matter Physics and New Materials
Nuclear Electronics, Nuclear Technology and Applications
Physics and Applied Physics Nuclear physics
Vibration, Noise and Control
Electroacoustic Technology
Acoustics/Electrics/Optics/Thermics
Circuit Principles and Analysis
Atomic Physics, Solid State Physics
Structure and Properties
Quantum Information Electronics, Optical Quantum Information Science
Space Science and Technology, etc.
Electrical and Electronic Technology
Semiconductor Physics
Track 3: Microelectronics Technology
Microelectronic Device Physics and Design
Optoelectronics, Photoelectric Technology and Its Applications
Integrated Circuit Manufacturing Process
Nuclear Electronics, Nuclear Technology and Applications
Vibration, Noise and Control
Microelectromechanical System Design and Manufacturing
Power Semiconductor Devices and Module Packaging
Electroacoustic Technology
Circuit Principles and Analysis
Sensor Interface Circuits, Weak Signal Processing and Low Noise Design
Quantum Information Electronics, Optical Quantum Information Science
Three-Dimensional IntSpace Science and Technology, etc.
egration (TSV), 2.Track 3: Microelectronics Technology
5D/3D Packaging, Heterogeneous Integration (Chiplet)
Microelectronic Device Physics and Design
Integrated Circuit Manufacturing Process
Flexible/Stretchable Electronic Devices and Thin Film Transistors (TFT)
Microelectromechanical System Design and Manufacturing
Power Semiconductor Devices and Module Packaging
Microelectronic Reliability, Failure Analysis, Testing and Yield Improvement ……Sensor Interface Circuits, Weak Signal Processing and Low Noise Design
Three-Dimensional Integration (TSV), 2.5D/3D Packaging, Heterogeneous Integration (Chiplet)
Flexible/Stretchable Electronic Devices and Thin Film Transistors (TFT)
Microelectronic Reliability, Failure Analysis, Testing and Yield Improvement ……