Scopes
(Include but not limited to)
Track 1: Integrated Circuit Design and EDA Technology
Digital Integrated Circuit Design and Verification
Analog/Mixed-Signal Integrated Circuit Design
RF/Millimeter Wave Integrated Circuit Design
Low-Power and Ultra-Low Voltage Integrated Circuit Design
High-Performance Processors and Accelerator Architectures
Memory Circuits and In-Network Computing
Reconfigurable Computing and FPGA Design
System-on-Chip (SoC) and IP Core Design
Three-Dimensional Integration and Chiplet Design Technology
Electronic Design Automation (EDA) Algorithms and Tools
Logic Synthesis, Layout Routing and Physical Design
Hardware Security and Integrated Circuit Trust Design
Core Interconnection and Advanced Packaging Co-design
Integrated Circuit Testing and Testability Design (DFT)
Architecture and Circuit Design for AI Chips
Track 2: Micro Systems and MEMS/NEMS Technology
MEMS/NEMS Device Design and Fabrication
Micro/Nano Sensors and Actuators
Inertial MEMS and Micro Inertial Measurement Units
RF MEMS and Micro Resonators
Optical MEMS and Micro-Mechanical Systems
Biological MEMS and Microfluidic Chips
Micro/Nano Energy Devices and Energy Harvesting
Micro System Packaging and Integration Technology
Micro/Nano Processing Technologies and Manufacturing Techniques
Micro System Reliability and Failure Analysis
Micro/Nano Scale Modeling and Simulation
Flexible/Wearable Micro Systems
Micro System Testing and Characterization Techniques
Micro/Nano Robots and Micro Drive Technologies
Track 3: Intelligent Micro Systems and Cross-Applications
Intelligent Sensors and Sensor Fusion Systems
Neural Morphology Chips and Brain Computing Hardware
Computational Storage and Sensing-Computing Integration Architectures
Edge Intelligent Chips and Embedded AI
Internet of Things Chips and Low-Power Wireless SoC
Automotive Electronic Chips and Automotive-Grade Integrated Circuits
Biomedical Micro Systems and Implantable Devices
Quantum Computing Chips and Quantum Devices
Optoelectronic Fusion Integrated Chips and Silicon Photonics Technology
Applications of Intelligent Micro Systems in Industry, Healthcare, and Consumer Electronics
Micro System and Artificial Intelligence Co-design
Digital Twin-driven Chips and Micro System Simulation
RF Micro Systems for 6G Communications
Security and Reliability of Intelligent Micro Systems
Micro System Industrialization and Manufacturing Ecosystem
......
Important Dates/重要日期
  • Submission Deadline: 2026.10.17
  • Registration Deadline: 2026.10.24
  • Conference Date: 2026.11.1
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  eicenfs_info@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

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  • +86-15680829715(微信同号)
  • 1347638002
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