Scopes
(Including but not limited to the following topics)
Track 1: Electronic Technology
Power Electronics Technology
Electronic Devices and Equipment
Power Electronics and Power Transmission
Giant Area Microelectronics
Digital Electronics and Information Engineering
MEMS Component Technology
System-level Design in Electronics
Electronics and Nanoelectronics
Epitaxy and Light Emitting Diodes
Optical Fibers and Optical Equipment
Three-Dimensional Semiconductor Device Technology
Circuit Analysis and Design
Microelectronics Science and Engineering
Advanced Electromagnetics
Communication Electronic Circuits
Microwave Photonic Devices Physics
Integrated Optics
Micro/Nano Systems and Networks
Track 2: Sensors
Sensors, Actuators and Their Applications
Sensing Materials
Multi-Sensor Information Fusion Technology
Physical, Chemical and Biological Sensors
Digital Output Sensors
Theory, Principles, Effect Design and Standardization of Sensors
Intelligent Sensors and Systems
Sensor Instruments
Virtual Instrument Sensor Interface
Network Signal Processing
Sensor Technology and Materials
Nanosensors
Microsystems
Sensor Circuits
Track 3: Integrated Circuit Design
High-Performance Integrated Circuit Design
Digital Circuit Design
Analog Circuit Design
ADC/DAC Design
Low-Power Logic Circuit Design
FPGA Architecture Design
Embedded Processor and System Design
RF Front-End Design and Optimization
Integrated Sensor Design
Microfabrication Processes
Lithography Technology
Advanced Packaging Technologies, such as TSV, CuNCAP
Reliability and Fault Analysis of Integrated Circuits
Integrated Circuit Security
Design and Optimization of Integrated Electric Vehicle Drive Systems
Track 1: Electronic Technology
Power Electronics Technology
Electronic Devices and Equipment
Power Electronics and Power Transmission
Giant Area Microelectronics
Digital Electronics and Information Engineering
MEMS Component Technology
System-level Design in Electronics
Electronics and Nanoelectronics
Epitaxy and Light Emitting Diodes
Optical Fibers and Optical Equipment
Three-Dimensional Semiconductor Device Technology
Circuit Analysis and Design
Microelectronics Science and Engineering
Advanced Electromagnetics
Communication Electronic Circuits
Microwave Photonic Devices Physics
Integrated Optics
Micro/Nano Systems and Networks
Track 2: Sensors
Sensors, Actuators and Their Applications
Sensing Materials
Multi-Sensor Information Fusion Technology
Physical, Chemical and Biological Sensors
Digital Output Sensors
Theory, Principles, Effect Design and Standardization of Sensors
Intelligent Sensors and Systems
Sensor Instruments
Virtual Instrument Sensor Interface
Network Signal Processing
Sensor Technology and Materials
Nanosensors
Microsystems
Sensor Circuits
Track 3: Integrated Circuit Design
High-Performance Integrated Circuit Design
Digital Circuit Design
Analog Circuit Design
ADC/DAC Design
Low-Power Logic Circuit Design
FPGA Architecture Design
Embedded Processor and System Design
RF Front-End Design and Optimization
Integrated Sensor Design
Microfabrication Processes
Lithography Technology
Advanced Packaging Technologies, such as TSV, CuNCAP
Reliability and Fault Analysis of Integrated Circuits
Integrated Circuit Security
Design and Optimization of Integrated Electric Vehicle Drive Systems
Important Dates/重要日期
- Submission Deadline: 2026.7.25
- Registration Deadline: 2026.8.1
- Conference Date: 2026.8.9
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: Copyiaet_irg@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
徐老师
+86-15680829715(微信同号)
1347638002
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