Scopes
(Include but not limited to)
Track 1: Electronic Materials and Advanced Characterization
Semiconductor Materials and Device Physics
Wide Bandgap and Narrow Bandgap Semiconductor Materials
Compound Semiconductors, Magnetic Semiconductors and Organic Semiconductors
Two-Dimensional Materials and Quantum Materials (Graphene, Transition Metal Sulfides, etc.)
Perovskite Materials and Photovoltaic Applications
Flexible, Wearable and Bioelectronic Materials
Piezoelectric, Pyroelectric and Frictional Electric Materials and Devices
Dielectric Materials and High-k Gate Dielectrics
Interconnect Materials and Advanced Metallization Technologies
Electronic Packaging Materials and Thermal Management Materials
Organic Electronic Materials and Devices
Material Characterization Techniques and Instruments (SEM, TEM, XPS, AFM, etc.)
Material Computing and Machine Learning Assisted Material Design
Material Reliability and Failure Analysis
Track 2: Optics and Optoelectronic Devices
Semiconductor Lasers and Light Emitting Diodes
Optical Detectors and Infrared/Terahertz Detection Technologies
Solar Cells and Photovoltaic Energy Conversion Devices
Organic Optoelectronic Materials and Devices
Quantum Dots and Nanophotonics Devices
Plasmonics Photonics and Metamaterials
Integrated Optics and Silicon Photonics
Optical Modulators, Optical Switches and Optical Interconnect Devices
Optical Communication Devices and Systems
Optical Sensing and Biomedical Optics
Nonlinear Optics and Quantum Optics Devices
Micro/Nano Optoelectromechanical Systems and Optical MEMS
Display Technology and Optical Imaging
Holography and Diffraction Optical Elements
Preparation and Characterization of Photonic Materials and Devices
Track 3: Semiconductor Technology and Integrated Systems
Integrated Circuit Design and Manufacturing Process
Advanced CMOS Technology and Device Integration
Three-Dimensional Integration and Chiplet Technology
Heterogeneous Integration and Hetero-Integration Technologies
Advanced Packaging Technologies (SiP, WLP, Hybrid Bonding, etc.)
Core-Module Interconnection and High-Speed Interface Technologies
Silicon Photonics Integration and Photonic-Coupled Chips
MEMS/NEMS Devices and Microsystem Integration
Neural Morphology Chips and Brain Computing Hardware
Compute-Store-All and Sensing-Storage-All Integrated Architectures
Flexible Electronics and Wearable Integrated Systems
Power Semiconductor Devices and Power Integration Technologies
RF Front-End Integration and Millimeter Wave Integration Technologies
Semiconductor Device Testing and Reliability
Semiconductor Device Modeling, Simulation and Verification
......
Important Dates/重要日期
  • Submission Deadline: 2026.11.13
  • Registration Deadline: 2026.11.20
  • Conference Date: 2026.11.28
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  isubmit_paper@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

徐老师
  • +86-15680829715(微信同号)
  • 1347638002
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