Scopes
(The following topics include but are not limited to)
Track 1: Electronic Devices
Advanced transistor devices such as MOSFET, FinFET, GAA
Power semiconductor devices (IGBT, SiC MOSFET, GaN HEMT)
Storage devices: Flash, MRAM, ReRAM, PCRAM
Optoelectronic devices: LED, laser, photodetector, optical modulator
Sensor devices: MEMS sensors, biosensors, gas sensors
Flexible and stretchable electronic devices
Two-dimensional material-based electronic devices
RF microwave devices and millimeter-wave devices
Quantum devices and single-electron devices
Thin-film transistor (TFT) devices
Photovoltaic devices and photovoltaic energy conversion devices
Device reliability, aging mechanism and failure analysis
Radiation effects and radiation-hardened electronic devices
Nanoelectronic devices and nanoscale device physics
Display devices and microdisplay chip devices
Thermoelectric energy harvesting devices
Track 2: Semiconductor Materials
Silicon-based semiconductor materials and silicon epitaxy technology
Third-generation semiconductor materials: silicon carbide, gallium nitride, gallium oxide
Two-dimensional semiconductor materials: graphene, MoS₂, h-BN, etc.
Semiconductor thin-film materials and deposition processes (CVD, PVD, ALD)
Semiconductor photoresist, masks and photolithography supporting materials
Semiconductor doping, ion implantation and activation technology
Metallization, dielectric layers and low-k/high-k dielectric materials
Organic semiconductor materials
Semiconductor single crystal growth and defect control
Semiconductor material characterization and testing analysis techniques
Wide bandgap, ultra-wide bandgap semiconductor materials
Semiconductor packaging materials: plastic packaging materials, thermal materials, substrate materials
Nano semiconductor materials and quantum dot materials
Semiconductor etching, cleaning and surface treatment materials
Track 3: Circuit Systems
Analog integrated circuits and RF integrated circuit design
Digital integrated circuits, low-power VLSI and SoC systems
Power management integrated circuits and power integrated circuits
Computational-acquisition circuits and neural network chip circuits
High-speed interface circuits and serial communication circuits
Sensor readout circuits and signal conditioning circuits
FPGA/ASIC architecture design and verification
Millimeter-wave/microwave front-end circuit systems
Integrated circuit layout, timing analysis and physical design
Integrated circuit testing, testability design and fault diagnosis
Embedded systems and on-chip network NoC
Hardware security, chip-side side-channel protection
Power distribution network and electromagnetic compatibility design
Integrated circuit thermal design and reliability circuit design
Mixed-signal circuits and digital-analog mixed systems
Vehicle chip circuits and automotive electronic systems
Integrated circuit packaging testing system and board-level circuit design
Artificial intelligence chip architecture and accelerator circuits
Internet of Things terminal circuits and low-power sensing systems
Optoelectronic integrated circuit circuits and photonic integrated circuit systems
...
Track 1: Electronic Devices
Advanced transistor devices such as MOSFET, FinFET, GAA
Power semiconductor devices (IGBT, SiC MOSFET, GaN HEMT)
Storage devices: Flash, MRAM, ReRAM, PCRAM
Optoelectronic devices: LED, laser, photodetector, optical modulator
Sensor devices: MEMS sensors, biosensors, gas sensors
Flexible and stretchable electronic devices
Two-dimensional material-based electronic devices
RF microwave devices and millimeter-wave devices
Quantum devices and single-electron devices
Thin-film transistor (TFT) devices
Photovoltaic devices and photovoltaic energy conversion devices
Device reliability, aging mechanism and failure analysis
Radiation effects and radiation-hardened electronic devices
Nanoelectronic devices and nanoscale device physics
Display devices and microdisplay chip devices
Thermoelectric energy harvesting devices
Track 2: Semiconductor Materials
Silicon-based semiconductor materials and silicon epitaxy technology
Third-generation semiconductor materials: silicon carbide, gallium nitride, gallium oxide
Two-dimensional semiconductor materials: graphene, MoS₂, h-BN, etc.
Semiconductor thin-film materials and deposition processes (CVD, PVD, ALD)
Semiconductor photoresist, masks and photolithography supporting materials
Semiconductor doping, ion implantation and activation technology
Metallization, dielectric layers and low-k/high-k dielectric materials
Organic semiconductor materials
Semiconductor single crystal growth and defect control
Semiconductor material characterization and testing analysis techniques
Wide bandgap, ultra-wide bandgap semiconductor materials
Semiconductor packaging materials: plastic packaging materials, thermal materials, substrate materials
Nano semiconductor materials and quantum dot materials
Semiconductor etching, cleaning and surface treatment materials
Track 3: Circuit Systems
Analog integrated circuits and RF integrated circuit design
Digital integrated circuits, low-power VLSI and SoC systems
Power management integrated circuits and power integrated circuits
Computational-acquisition circuits and neural network chip circuits
High-speed interface circuits and serial communication circuits
Sensor readout circuits and signal conditioning circuits
FPGA/ASIC architecture design and verification
Millimeter-wave/microwave front-end circuit systems
Integrated circuit layout, timing analysis and physical design
Integrated circuit testing, testability design and fault diagnosis
Embedded systems and on-chip network NoC
Hardware security, chip-side side-channel protection
Power distribution network and electromagnetic compatibility design
Integrated circuit thermal design and reliability circuit design
Mixed-signal circuits and digital-analog mixed systems
Vehicle chip circuits and automotive electronic systems
Integrated circuit packaging testing system and board-level circuit design
Artificial intelligence chip architecture and accelerator circuits
Internet of Things terminal circuits and low-power sensing systems
Optoelectronic integrated circuit circuits and photonic integrated circuit systems
...
Important Dates/重要日期
- Submission Deadline: 2026.11.16
- Registration Deadline: 2026.11.23
- Conference Date: 2026.12.1
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: iacademic_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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