Scopes
(The following topics include but are not limited to)
Track 1: Electronic Devices
Semiconductor Materials Innovation
Nanoelectronic Devices
Organic Electronic Technology
Power Device Design
Development of Sensor Technology
Flexible Electronic Devices
Microelectronic Manufacturing Processes
Quantum Electronic Devices
Research on Optoelectronic Devices
High-Frequency Electronic Devices
New Storage Devices
Low-Power Electronic Design
Thermal Management Technology
Device Reliability Analysis
Track 2: Integrated Circuits
High-Performance Integrated Circuit Design
Digital Circuit Design, Analog Circuit Design
ADC/DAC Design
Low-Power Logic Circuit Design
FPGA Architecture Design
Embedded Processor and System Design
RF Front-End Design and Optimization
Integrated Sensor Design
Microfabrication Processes
Lithography Technology
Advanced Packaging Technologies, such as TSV, CuNCAP
Reliability Analysis of Integrated Circuits
Integrated Circuit Security
Design and Optimization of Integrated Electric Vehicle Drive Systems
Fault Diagnosis and Fault Repair Technology
Track 3: Optoelectronic Technology
Research and Development of Optoelectronic Materials and Devices
Optoelectronic Imaging and Detection Technology
Optical Communication Systems and Components
Latest Developments in Disc Storage Technology
Display Technology and New Display Materials
Terahertz Technology
Optical Sensors
Optical Interconnection Technology
Semiconductor Lighting Technology
Nanophotonics
Micro-Nano Optoelectronic Mechanical Systems (MOEMS)
Signal Processing and Optoelectronic Information Technology
Image and Signal Processing
Optical Information Processing Technology
Track 1: Electronic Devices
Semiconductor Materials Innovation
Nanoelectronic Devices
Organic Electronic Technology
Power Device Design
Development of Sensor Technology
Flexible Electronic Devices
Microelectronic Manufacturing Processes
Quantum Electronic Devices
Research on Optoelectronic Devices
High-Frequency Electronic Devices
New Storage Devices
Low-Power Electronic Design
Thermal Management Technology
Device Reliability Analysis
Track 2: Integrated Circuits
High-Performance Integrated Circuit Design
Digital Circuit Design, Analog Circuit Design
ADC/DAC Design
Low-Power Logic Circuit Design
FPGA Architecture Design
Embedded Processor and System Design
RF Front-End Design and Optimization
Integrated Sensor Design
Microfabrication Processes
Lithography Technology
Advanced Packaging Technologies, such as TSV, CuNCAP
Reliability Analysis of Integrated Circuits
Integrated Circuit Security
Design and Optimization of Integrated Electric Vehicle Drive Systems
Fault Diagnosis and Fault Repair Technology
Track 3: Optoelectronic Technology
Research and Development of Optoelectronic Materials and Devices
Optoelectronic Imaging and Detection Technology
Optical Communication Systems and Components
Latest Developments in Disc Storage Technology
Display Technology and New Display Materials
Terahertz Technology
Optical Sensors
Optical Interconnection Technology
Semiconductor Lighting Technology
Nanophotonics
Micro-Nano Optoelectronic Mechanical Systems (MOEMS)
Signal Processing and Optoelectronic Information Technology
Image and Signal Processing
Optical Information Processing Technology
Important Dates/重要日期
- Submission Deadline: 2026.7.24
- Registration Deadline: 2026.7.31
- Conference Date: 2026.8.8
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icramd_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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