Scopes
(The following topics include but are not limited to)
Track 1: Electronic Devices
Semiconductor Materials Innovation
Nanoelectronic Devices
Organic Electronic Technology
Power Device Design
Integrated Circuit Design
Development of Sensor Technology
Flexible Electronic Devices
Microelectronic Manufacturing Processes
Quantum Electronic Devices
Research on Optoelectronic Devices
High-Frequency Electronic Devices
New Storage Devices
Low-Power Electronic Design
Thermal Management Technology
Device Reliability Analysis
Track 2: Integrated Circuit Design
Circuit Simulation and Modeling
Circuits and Systems
Integrated Circuit and System Design
Integrated Circuit Design and Manufacturing
Very Large Scale Integrated Circuit (VLSI)
System-on-Chip (SoC) Design
Low-Power Design Techniques
Radio Frequency Integrated Circuit (RFIC)
Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and Applications
Digital Integrated Circuit Design
Security and Reliability of Integrated Circuits
Market Trends and Challenges in the Integrated Circuit Industry
Modular Design and System Integration
Track 3: Materials Physics
Material Physics and Structure
Material Thermodynamics
Material Engineering Fundamentals
Quantum Mechanics
Mechanical Properties of Materials
Microelectronic Materials
Superconductors
Materials Physics and Chemistry
Material Preparation Technology
Atomic Physics
Solid State Physics
Optoelectronic Materials Semiconductor
Nanomaterials and Nanotechnology ......
Track 1: Electronic Devices
Semiconductor Materials Innovation
Nanoelectronic Devices
Organic Electronic Technology
Power Device Design
Integrated Circuit Design
Development of Sensor Technology
Flexible Electronic Devices
Microelectronic Manufacturing Processes
Quantum Electronic Devices
Research on Optoelectronic Devices
High-Frequency Electronic Devices
New Storage Devices
Low-Power Electronic Design
Thermal Management Technology
Device Reliability Analysis
Track 2: Integrated Circuit Design
Circuit Simulation and Modeling
Circuits and Systems
Integrated Circuit and System Design
Integrated Circuit Design and Manufacturing
Very Large Scale Integrated Circuit (VLSI)
System-on-Chip (SoC) Design
Low-Power Design Techniques
Radio Frequency Integrated Circuit (RFIC)
Power Management Integrated Circuit (PMIC)
Digital Signal Processor (DSP) and Applications
Digital Integrated Circuit Design
Security and Reliability of Integrated Circuits
Market Trends and Challenges in the Integrated Circuit Industry
Modular Design and System Integration
Track 3: Materials Physics
Material Physics and Structure
Material Thermodynamics
Material Engineering Fundamentals
Quantum Mechanics
Mechanical Properties of Materials
Microelectronic Materials
Superconductors
Materials Physics and Chemistry
Material Preparation Technology
Atomic Physics
Solid State Physics
Optoelectronic Materials Semiconductor
Nanomaterials and Nanotechnology ......
Important Dates/重要日期
- Submission Deadline: 2026.6.17
- Registration Deadline: 2026.6.24
- Conference Date: 2026.7.2
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: coartn_aeps@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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+86---(微信同号)
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