Welcome to ICSMPD 2026

2026 International Conference on Semiconductor Materials, Precision Machinery and Electronic Devices

Scopes
(The following topics include but are not limited to)
Track 1: Semiconductor Materials
Development of New Semiconductor Materials
Application of Nanomaterials and Two-Dimensional Materials
Characterization Techniques of Semiconductor Materials
Crystal Growth and Material Preparation
Material Defects and Interface Engineering
Functional Materials and Composite Materials
Advanced Deposition and Etching Processes
Wafer Processing and Manufacturing Technology
Material Reliability and Failure Analysis
Application of Material Innovation in Semiconductor Devices
Track 2: Precision Machinery
Mechanical Control, Mechanical Design
Advanced Manufacturing Technology
Mechatronics, Micro-Electro-Mechanical Systems CAD/CAM/CAE
Microfabrication
Integrated automation, mechanical manufacturing automation
Robotics, human-computer interaction Intelligent Manufacturing
Precision processing and inspection technology
Laser processing technology, numerical control technology
Track 3: Electronic devices
Nanoelectronic devices
Organic electronic technology
Power device design
Integrated circuit design
Development of sensor technology
Flexible electronic devices
Microelectronic manufacturing process
Quantum electronic devices
Research on optoelectronic devices
High-frequency electronic devices
New types of storage devices
Low-power electronic design
Thermal management technology
Device reliability analysis ……
Important Dates | 重要日期
  • Submission Deadline: 2026.6.13
  • Registration Deadline: 2026.6.20
  • Conference Date: 2026.6.28
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  icvda_epg@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

蒋老师
  • +86-15680824672(微信同号)
  • 3761629232
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Indexing Service | 索引服务