Scopes
(The following topics include but are not limited to)
Topic 1: Nuclear Technology
Nuclear aberration analysis technique
Nuclear imaging technology
Nuclear property
nuclear reaction
reactor
accelerator
radiation source
Nuclear radiation detector
Radiation processing
Nuclear imaging technology
Nuclear analysis technology
Nuclear agriculture
nuclear power plant
(Industrial) nuclear testing
nuclear medicine
Isotope geology
atomic bomb
nuclear weapon
nuclear energy
Radiation technology
nuclear energy
thermal engineering
nuclear power
Topic 2: Semiconductors
Extreme Ultraviolet Photolithography (EUV) Technology
3D Integrated Circuit and Its Manufacturing Process
Advanced packaging and testing technology
Optimization and Automation of Semiconductor Manufacturing Process
New semiconductor materials (such as silicon carbide, gallium nitride, and two-dimensional materials)
Advanced CMOS technology
Efficient power semiconductor devices
Nanoscale electronic devices
Topic 3: Applied Materials
Nonferrous metal materials
Advanced composite materials
Powder metallurgy materials
Electronic Information Materials
Material Genetic Engineering
Integrated Computing Materials Engineering
Functional Materials and Devices
New Energy and Catalytic Materials
Advanced Ceramics and Coating Materials
Research and development of new materials
Topic 1: Nuclear Technology
Nuclear aberration analysis technique
Nuclear imaging technology
Nuclear property
nuclear reaction
reactor
accelerator
radiation source
Nuclear radiation detector
Radiation processing
Nuclear imaging technology
Nuclear analysis technology
Nuclear agriculture
nuclear power plant
(Industrial) nuclear testing
nuclear medicine
Isotope geology
atomic bomb
nuclear weapon
nuclear energy
Radiation technology
nuclear energy
thermal engineering
nuclear power
Topic 2: Semiconductors
Extreme Ultraviolet Photolithography (EUV) Technology
3D Integrated Circuit and Its Manufacturing Process
Advanced packaging and testing technology
Optimization and Automation of Semiconductor Manufacturing Process
New semiconductor materials (such as silicon carbide, gallium nitride, and two-dimensional materials)
Advanced CMOS technology
Efficient power semiconductor devices
Nanoscale electronic devices
Topic 3: Applied Materials
Nonferrous metal materials
Advanced composite materials
Powder metallurgy materials
Electronic Information Materials
Material Genetic Engineering
Integrated Computing Materials Engineering
Functional Materials and Devices
New Energy and Catalytic Materials
Advanced Ceramics and Coating Materials
Research and development of new materials
Important Dates/重要日期
- Submission Deadline: 2026.5.17
- Registration Deadline: 2026.5.25
- Conference Date: 2026.6.02
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icsdem_info@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
叶老师
+86-17162862552(微信同号)
317162862552
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