Scopes
(Including but not limited to the following topics)
Track 1: Integrated Circuits and Chip Design
Digital Integrated Circuit Design and Verification
Analog and Mixed-Signal Integrated Circuits
Radio Frequency and Millimeter Wave Integrated Circuits
Low-Power and Sub-Threshold Circuit Design
In-N-Memory Computing and Near-In-Memory Computing
Three-Dimensional Integration and Chiplet Technology
Silicon Photonics and Optical Interconnection Chips
Power Integrated Circuits and Power Management
Integrated Circuit Testing and Reliability
EDA Tools and Design Automation
Advanced Packaging and Heterogeneous Integration
FPGA and Reconfigurable Computing
Sensor Interface Circuits and Readout Circuits
AI Accelerators and Domain-Specific Chips
New-Type Memory Devices and Circuits
Track 2: Machine Learning and Algorithms
Machine Learning and Deep Learning
Reinforcement Learning and Decision Making
Generative Models and Diffusion Models
Graph Neural Networks and Graph Learning
Transfer Learning and Domain Adaptation
Federated Learning and Privacy Protection
Interpretable Artificial Intelligence
Large Language Models and Fine-Tuning
Self-Supervised and Semi-Supervised Learning
Multimodal Learning and Fusion
Neural Network Architecture Search
Model Compression and Lightweighting
Edge Machine Learning and End-Side Deployment
Physical Information Machine Learning
Machine Learning Theory and Optimization
Track 3: Intelligent Sensing and System Applications
Intelligent Sensor Design and Manufacturing
MEMS/NEMS Sensors
Multi-Sensor Fusion and Perception
Flexible Wearable Sensors
Optoelectronic and Image Sensors
Biomedical Sensors
Environmental and Gas Sensors
Acoustic and Ultrasonic Sensing
Inertial Sensors and Navigation
Tactile and Force Sensing
Sensor Signal Processing and Interface Circuits
Edge Intelligence and Real-Time Perception
Wireless Sensor Network
Intelligent sensing system integration
Application of sensors in industry and healthcare
Track 1: Integrated Circuits and Chip Design
Digital Integrated Circuit Design and Verification
Analog and Mixed-Signal Integrated Circuits
Radio Frequency and Millimeter Wave Integrated Circuits
Low-Power and Sub-Threshold Circuit Design
In-N-Memory Computing and Near-In-Memory Computing
Three-Dimensional Integration and Chiplet Technology
Silicon Photonics and Optical Interconnection Chips
Power Integrated Circuits and Power Management
Integrated Circuit Testing and Reliability
EDA Tools and Design Automation
Advanced Packaging and Heterogeneous Integration
FPGA and Reconfigurable Computing
Sensor Interface Circuits and Readout Circuits
AI Accelerators and Domain-Specific Chips
New-Type Memory Devices and Circuits
Track 2: Machine Learning and Algorithms
Machine Learning and Deep Learning
Reinforcement Learning and Decision Making
Generative Models and Diffusion Models
Graph Neural Networks and Graph Learning
Transfer Learning and Domain Adaptation
Federated Learning and Privacy Protection
Interpretable Artificial Intelligence
Large Language Models and Fine-Tuning
Self-Supervised and Semi-Supervised Learning
Multimodal Learning and Fusion
Neural Network Architecture Search
Model Compression and Lightweighting
Edge Machine Learning and End-Side Deployment
Physical Information Machine Learning
Machine Learning Theory and Optimization
Track 3: Intelligent Sensing and System Applications
Intelligent Sensor Design and Manufacturing
MEMS/NEMS Sensors
Multi-Sensor Fusion and Perception
Flexible Wearable Sensors
Optoelectronic and Image Sensors
Biomedical Sensors
Environmental and Gas Sensors
Acoustic and Ultrasonic Sensing
Inertial Sensors and Navigation
Tactile and Force Sensing
Sensor Signal Processing and Interface Circuits
Edge Intelligence and Real-Time Perception
Wireless Sensor Network
Intelligent sensing system integration
Application of sensors in industry and healthcare
Important Dates | 重要日期
- Submission Deadline: November 25, 2026
- Registration Deadline: December 4, 2026
- Conference Date: December 12, 2026
- Notification Date: About a week after the submission
Submission Portal | 投稿方式
Mail Address: ic_conf@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
谢老师
15528045772
3825393354
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