Scopes
Topic 1: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography technology
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Design and Optimization of Integrated Electric Vehicle Drive System
Fault diagnosis and repair technology
Topic 2: Micro Electro Mechanical Systems and Sensors
THz and Microwave Microsystems
Display, sensors, and MEMS
Energy harvesting and wireless sensors
Biological MEMS and Biomedical Sensors
Important Dates/重要日期
  • Submission Deadline: 2025.11.1
  • Registration Deadline: 2025.11.8
  • Conference Date: 2025.11.21
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  cq_committee@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

田老师
  • +86-17162865530(微信同号)
  • 3766818743
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