Scopes
Topic 1: Electromagnetics
Electromagnetic compatibility function
Magnetic materials
Non record application multi-layer fusion magnet GMR
Magnetic contact
Shrink insulation
Intermetallic dielectric
Large scale superconductivity of hard magnets
Related systems for suspended transportation and propulsion
Magnet Design and Analysis Technology
Magnetic stability
Magnetization effect
Communication loss
Protecting magnetic fluids and separating magnetic microscopes
Imaging magnetic semiconductor magnetic thin film
Nanostructured magnetic tunneling junction
Magnetization and time dependence
Magneto thermal material device
Magnetodynamics
Ferromagnetic resonance magneto elastic material
Device magnetic impedance
High frequency materials, magneto-optical materials, and devices
Topic 2: Semiconductors
Magnetic semiconductor
Organic semiconductor
Advanced photoresist
Optoelectronics and photovoltaic devices
Semiconductor physics
Semiconductor quantum computing
Reliability of Semiconductor Materials and Devices
Semiconductor Manufacturing and Applications
Emerging semiconductor technologies
3D semiconductor device technology, etc
Topic 3: Electronic Information
Signal processing
Wireless networks and information systems
The sixth generation mobile communication technology (6G)
Sensors and the Internet of Things
Mobile computing and edge computing
GPS and wireless positioning
Physical Electronics
Microelectronics and Solid State Electronics
Electromagnetic Field and Microwave Technology
Circuits and Systems
Integrated Air Ground Communication Network Technology
Integrated Stereoscopic Imaging and Machine Vision Technology
Optoelectronic Signal and Information Processing
Communication Electronic Circuit and Technology
Fundamentals of Electric Circuits
Exchange technology
Computer Communication Network
Digital Electronic Technology
Optical fiber communication
Wireless communication
Analog communication
Integrated Circuit
Important Dates/重要日期
  • Submission Deadline: 2026.10.15
  • Registration Deadline: 2026.10.22
  • Conference Date: 2026.11.4
  • Notification Date: About a week after the submission
Submission Portal/投稿方式

Mail Address:  inter_conf@126.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

唐老师
  • +86-17168296597(微信同号)
  • 3264234551
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