2026应急管理、路面预警与集成电路国际会议(ICEMRW 2026)
2026 International Conference on Emergency Management, Road Warning, and Integrated Circuits
Submission Deadline
2026.6.09
Registration Deadline
2026.6.17
Conference Date
2026.6.24
Notification Date: About a week after the submission
城市: 深圳
距会议开始还有
0
天
00
时
00
分
00
秒
欢迎投稿~
Scopes
(The following topics include but are not limited to)
Topic 1: Emergency Management
Warning and emergency management
Urban Environment and Emergency Management
Emergency preparedness and response legislation
Emergency wireless message
Emergency management training simulation
Collaboration and Social Networks
Humanitarian Action
Evacuation procedures for visually impaired individuals
Information analysis and infrastructure protection
Emergency Expert System
Topic 2: Road Warning
Road survey, design and planning
Road protection and ecological restoration
Roadbed rock and soil engineering
Special roadbed disease treatment
New theories and technologies in roadbed engineering
Road surface materials (asphalt, concrete, etc.)
New materials and processes for road engineering
Road maintenance and management
Topic Three: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Topic 1: Emergency Management
Warning and emergency management
Urban Environment and Emergency Management
Emergency preparedness and response legislation
Emergency wireless message
Emergency management training simulation
Collaboration and Social Networks
Humanitarian Action
Evacuation procedures for visually impaired individuals
Information analysis and infrastructure protection
Emergency Expert System
Topic 2: Road Warning
Road survey, design and planning
Road protection and ecological restoration
Roadbed rock and soil engineering
Special roadbed disease treatment
New theories and technologies in roadbed engineering
Road surface materials (asphalt, concrete, etc.)
New materials and processes for road engineering
Road maintenance and management
Topic Three: Integrated Circuits
High performance integrated circuit design
Digital Circuit Design
Analog Circuit Design
ADC/DAC design
Low power logic circuit design
FPGA architecture design
Embedded processors and system design
RF front-end design and optimization
Integrated Sensor Design
Micro processing technology
Lithography
Advanced packaging technologies such as TSV and CuNCAP
Aging and Fault Analysis of Integrated Circuits
Integrated Circuit Safety
Important Dates/重要日期
- Submission Deadline: 2026.6.09
- Registration Deadline: 2026.6.17
- Conference Date: 2026.6.24
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: paper_in@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
李老师
+86-13281038829(微信同号)
2524746508
--
+86---(微信同号)
--
