Welcome to ICDMT 2026

2026 International Conference on Integrated Circuits, Semiconductor Devices and Microelectronics Tec

Scopes
(Including but not limited to the following topics)
Track 1: Integrated Circuits
Integrated Circuit Design and Manufacturing
Very Large Scale Integrated Circuits (VLSI)
System-on-Chip (SoC) Design, Low Power Design Techniques
Radio Frequency Integrated Circuits (RFIC)
Power Management Integrated Circuits (PMIC)
Digital Signal Processors (DSP) and Applications
Digital Integrated Circuit Design
Analog and Mixed-Signal Circuit Design
High-Frequency (RF) and Microwave Circuit Design
Reconfigurable and Adaptive Circuit Design
Semiconductor Process Technology
Nanofabrication and Process Development
Packaging Technology and 3D Integrated Circuits
Chip Testing and Fault Diagnosis
Applications of Materials Science in Integrated Circuits
Artificial Intelligence and Machine Learning in Integrated Circuits
Integrated Circuit Solutions for IoT Devices
Silicon Photonics Integrated Circuits
Applications of New Devices (such as memristors) in Integrated Circuit Design
Modular Design and System Integration
Track 2: Semiconductor Devices
New Semiconductor Materials and Their Applications in Devices
High-Performance MOSFET Design and Optimization
Energy Efficiency Optimization of Power Devices
III-V Group Compound Semiconductor Devices Beyond Silicon
Microoptoelectronic Semiconductor Sensors and Their Applications
Semiconductor Lasers and Emerging Application Domains
Graphene and Other Two-Dimensional Materials Devices
Quantum Dots and Quantum Wells Semiconductor Devices
New Memory Devices: RRAM, MRAM, FeRAM
Challenges and Opportunities of Low-Temperature Electronic Devices
Breakthrough Technologies for High-Frequency and High-Power Devices
Silicon-Based Optoelectronic Devices and Their Integration Technologies
Tunnel Field-Effect Transistors (TFET) Device Research
Reliability and Aging Mechanisms of Semiconductor Devices
The Impact of Advanced Packaging and Interconnection Structures on Device Performance
Track 3: Microelectronic Technology
Research and Application of New Semiconductor Materials
Design and Optimization of Silicon-Based Optoelectronic Devices
Application of Nanomaterials in Microelectronic Devices
Development and Performance Optimization of Low-Power Electronic Devices
Application of Quantum Dots in Optoelectronics
High-Frequency and Ultra-High Frequency Circuit Design Technology
Low-Power Circuit Design and Optimization
Signal Processing Technology in Integrated Circuits
Design and Application of Power Electronic Devices
Advanced Packaging Technology and Integration Schemes
Microelectronic Devices in 5G and Future Communication Technologies
Quantum Communication and Quantum Information Technology
New Applications of Photonic Integrated Circuits in Communication
Intelligent Sensor Networks and Data Processing Technology
Research and Innovation in High-Speed Data Transmission Technology ......
Important Dates | 重要日期
  • Submission Deadline: 2026.7.5
  • Registration Deadline: 2026.7.12
  • Conference Date: 2026.7.20
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

Mail Address:  icmbga_conf@163.com

If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

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  • +86-15680829715(微信同号)
  • 1347638002
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Indexing Service | 索引服务