(Including but not limited to the following topics)
Topic 1: AI Chips
AI Training Chips and Inference Chips
Neural Network Processing Unit (NPU)
Tensor Processors and Matrix Calculation Acceleration
Memory-Computing Integration and Near-Memory Computing
Brain-like Chips and Spiking Neural Networks
Low-Power Design Techniques for AI Chips
Reconfigurable AI Computing Chips
Edge AI Chips and End-Terminal Inference
Specialized Acceleration Chips for Large Models
Chiplet and Heterogeneous Integrated AI Chips
AI Chip Cooling and Packaging Technologies
Analog and Mixed-Signal AI Computing
FPGA Applications in AI Acceleration
AI Chip Design Automation Tools
Topic 2: Intelligent Computing
Neuro-Semantic Computing and Spiking Neural Networks
Quantum Intelligent Computing
Cognitive Computing and Brain-like Computing
Computing-Storage Integrated Architecture
Edge Intelligent Computing and Cloud-Edge Collaboration
High-Performance Computing and AI Fusion
Distributed Heterogeneous Intelligent Computing
Adaptive and Self-Evolving Computing Architectures
Approximate Computing and Stochastic Computing
Model Compression and Lightweight Inference
Event-Driven Computing
Optical-Electronic Hybrid Intelligent Computing
Biological-Inspired Computing
Energy Efficiency Optimization in Intelligent Computing
Topic 3: Semiconductor Architecture
Advanced Micro-Architectures (such as RISC-V Architecture)
Multi-Core and Many-Core Processor Architectures
Ultra-Large-Scale Integrated Circuit Design
On-Chip Network and Interconnection Architecture
Three-Dimensional Integrated Circuits and Heterogeneous Integration
High-Bandwidth Storage and HBM Technology
FinFET and GAA Transistor Technology
Semiconductor Device Physics and Modeling
Post-Moore Era New Architectures (such as CFET)
Low Leakage and Low-Power Design
Timing Convergence and Physical Design
Semiconductor Process and Architecture Co-Design
Advanced Packaging Technologies (Chiplet, 2.5D/3D)
New Non-Volatile Storage Devices and Architectures