Scopes
(The following topics include but are not limited to)
Track 1: Advanced Electronic Materials
Nanomaterials and Nanotechnology
Semiconductor Materials and Devices
Electronic Packaging and Interconnection Technologies
Flexible Electronics and Smart Wearable Devices
High-Frequency Electronic Materials and Applications
Electronic Ceramics and Catalytic Materials
Optoelectronic Materials and LED Technology
Thermoelectric Materials and Thermal Management Technologies
Battery Technology and Energy Storage
New Display Technologies and Materials
Track 2: Semiconductor Devices
New Semiconductor Materials and Their Applications in Devices
High-Performance MOSFET Design and Optimization
Energy Efficiency Optimization of Power Devices
Beyond-Silicon III-V Group Compound Semiconductor Devices
Microoptoelectronic Semiconductor Sensors and Their Applications
Semiconductor Lasers and Emerging Application Domains
Graphene and Other Two-Dimensional Materials Devices
Quantum Dots and Quantum Wells Semiconductor Devices
New Memory Devices: RRAM, MRAM, FeRAM
Challenges and Opportunities of Low-Temperature Electronic Devices
Breakthrough Technologies for High-Frequency and High-Power Devices
Silicon-Based Optoelectronic Devices and Their Integration Technologies
Research on Tunnel Field-Effect Transistors (TFET) Devices
Reliability and Aging Mechanisms of Semiconductor Devices
The Impact of Advanced Packaging and Interconnection Structures on Device Performance ......
Track 3: Integrated Technologies
Three-dimensional Integrated Circuits and Their Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technologies
Development and Innovation of Packaging-level Integration Technologies
Thermal Management Technologies in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Security Challenges in Integrated Circuit Design
Silicon Photonics Interconnection Technology
Latest Advances in Ultra-Large Scale Integration Technologies
Emerging Memory Integration Technologies
Integration Applications of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensing Systems ......
Track 1: Advanced Electronic Materials
Nanomaterials and Nanotechnology
Semiconductor Materials and Devices
Electronic Packaging and Interconnection Technologies
Flexible Electronics and Smart Wearable Devices
High-Frequency Electronic Materials and Applications
Electronic Ceramics and Catalytic Materials
Optoelectronic Materials and LED Technology
Thermoelectric Materials and Thermal Management Technologies
Battery Technology and Energy Storage
New Display Technologies and Materials
Track 2: Semiconductor Devices
New Semiconductor Materials and Their Applications in Devices
High-Performance MOSFET Design and Optimization
Energy Efficiency Optimization of Power Devices
Beyond-Silicon III-V Group Compound Semiconductor Devices
Microoptoelectronic Semiconductor Sensors and Their Applications
Semiconductor Lasers and Emerging Application Domains
Graphene and Other Two-Dimensional Materials Devices
Quantum Dots and Quantum Wells Semiconductor Devices
New Memory Devices: RRAM, MRAM, FeRAM
Challenges and Opportunities of Low-Temperature Electronic Devices
Breakthrough Technologies for High-Frequency and High-Power Devices
Silicon-Based Optoelectronic Devices and Their Integration Technologies
Research on Tunnel Field-Effect Transistors (TFET) Devices
Reliability and Aging Mechanisms of Semiconductor Devices
The Impact of Advanced Packaging and Interconnection Structures on Device Performance ......
Track 3: Integrated Technologies
Three-dimensional Integrated Circuits and Their Manufacturing Processes
System-on-Chip (SoC) and Integration Methods
Chip Heterogeneous Integration Technologies
Development and Innovation of Packaging-level Integration Technologies
Thermal Management Technologies in Integrated Circuits
Radio Frequency Integrated Circuits and Design Optimization
Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed-Signal Integrated Circuits
Power Management Integrated Circuit Technology
Reliability and Security Challenges in Integrated Circuit Design
Silicon Photonics Interconnection Technology
Latest Advances in Ultra-Large Scale Integration Technologies
Emerging Memory Integration Technologies
Integration Applications of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensing Systems ......
Important Dates/重要日期
- Submission Deadline: 2026.7.22
- Registration Deadline: 2026.7.29
- Conference Date: 2026.8.6
- Notification Date: About a week after the submission
Submission Portal/投稿方式
Mail Address: icramd_info@163.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
蒋老师
+86-15680824672(微信同号)
3761629232
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+86---(微信同号)
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