Scopes
(The following topics include but are not limited to)
Topic 1: Chip Design
Digital chip design
Simulation chip design
RF chip design
Design of Mixed Signal Chip
System level chip design
Low power design of chips
Chip testability design
Chip design automation
Topic 2: Integrated Circuits
Digital Integrated Circuit Design
Analog Integrated Circuit Design
RF Integrated Circuit Design
Design of Mixed Signal Circuit
Memory Design
Integrated Circuit Testing Technology
Integrated Circuit Technology
Integrated Circuit Packaging
Topic 3: Semiconductor Technology
Semiconductor Materials and Devices
Power Semiconductor Technology
Wide bandgap semiconductor
Semiconductor optoelectronic devices
Semiconductor Process Simulation
Semiconductor equipment development
Semiconductor Packaging and Testing
Application of Semiconductor Technology
Trends in the semiconductor industry
Important Dates | 重要日期
  • Submission Deadline: 2026.7.9
  • Registration Deadline: 2026.7.19
  • Conference Date: 2026.7.24
  • Notification Date: About a week after the submission
Submission Portal | 投稿方式

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If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:

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