(Topics include but are not limited to)
High density interconnection
2.5D/3D integrated packaging
Wafer level packaging
system-level packaging
heterogeneous integration
chiplet
Embedded packaging
Three dimensional integrated circuits and their manufacturing processes
System on Chip (SoC) and Integration Methods
Heterogeneous chip integration technology
Development and Innovation of Package Level Integration Technology
Thermal management technology in integrated circuits
RF Integrated Circuit and Its Design Optimization
The Application of Artificial Intelligence and Machine Learning in Integrated Circuit Design
Advanced Analog and Mixed Signal Integrated Circuit
Power Management Integrated Circuit Technology
Reliability and Safety Challenges in Integrated Circuit Design
Silicon photonics interconnect technology
The latest progress in ultra large scale integration technology
Emerging Memory Integration Technologies
Integrated Application of Modular MEMS and NEMS
Integration and Innovation of Intelligent Sensor Systems