In the context of the accelerated penetration of the Internet of Things, intelligent sensing and edge computing, the cross integration of electronic circuits, sensors and micro electromechanical systems (MEMS) is becoming the core engine driving the transformation of intelligent hardware and sensing systems. From new sensor devices and interface circuits to MEMS design and manufacturing processes, from flexible electronics and wearable systems to edge intelligence and low-power circuits, breakthroughs in electronic circuits and micro/nano sensing technology are constantly expanding the performance boundaries and application scenarios of intelligent sensing systems.
The 2026 International Conference on Electronic Circuits, Sensors, and Micro Electro Mechanical Systems (ECSMS 2026) aims to build an interdisciplinary and cross-border high-end academic exchange platform, focusing on core issues such as electronic circuit and system design, sensor technology and intelligent perception, micro electro mechanical systems and micro nano manufacturing. It brings together experts, scholars, and industry representatives from global electronic engineering, sensor technology, micro nano manufacturing, and related fields to explore the innovative frontiers of intelligent perception hardware and micro systems.